SINGAPORE -- 29 JANUARY 2013, UNITED STATES--(Marketwire - Jan 28, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has signed a definitive Patent License and Settlement Agreement with Tessera, Inc. (the "Agreement").
STATS ChipPAC Announces Signing of Definitive Agreement Which Settles Litigation With Tessera, Inc. and Provides Update for Fourth Quarter 2012
Monday, 28 January 2013
STATS ChipPAC Announces Signing of Definitive Agreement Which Settles Litigation With Tessera, Inc. and Provides Update for Fourth Quarter 2012
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